HYPERION  

 GROUP

 
  HYPERION GROUP AVIONICS AUTOMOTIVE COMMUNICATIONS DEFENSE MEDICAL SPACE TECHNOLOGY SOLUTIONS  
  HYPERION GROUP GOLD CHIP TECHNOLOGY Space Semiconductor Technology FOR THE FUTURE  
 
     
HYPERION GROUP GOLD CHIP TECHNOLOGY FOR THE FUTURE

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HYPERION GROUP Companies, design and manufactures standard and custom semiconductor components for avionics, automotive, communications, computing, defense, medical, military, optoelectronics, telecommunications, space and  wireless applications.
HYPERION has undertaken the task to redesign and manufacture the future semiconductor components compatible with chip and wire, flip chip, chip scale CSP and surface mount technologies. In today's extreme miniaturization market, there is no more room for the large packages to protect the die. It means that the bare die has to survive on its own without the protection of a package. Known Good Die is useless if the die cannot withstand harsh environmental conditions and degrades. The solution developed by HYPERION for known good die for bare die applications is gold interconnection and well-engineered materials that further enhance the die reliability.

 
   
   
  HYPERION

GROUP

 
           
 
 

Hyperion Group Companies
 

Hte Labs

HTE Labs provides process specialties bipolar wafer foundry, BICMOS wafer foundry, thin film vacuum deposition services, applied thin film processing for analog and mixed signal bipolar manufacturing processes, Analog CMOS wafer foundry, R&D support, research and development support for microelectronics and process specialties wafer Fab processing to customers from semiconductors and microelectronics industry. Bipolar wafer foundry includes the following processes: 20V bipolar process,45V bipolar process,75V bipolar process,25V super-beta bipolar process and high voltage dielectric isolated bipolar processes. R&D support is provided in the following fields of microelectronics: test and measurement, medical instrumentation, industrial process control and communications, thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), MEMS technology, smart sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications including SAW, Ti diffusion, light wave guides and Mach-Zender light modulators. Specialty wafer Fab processing: epi deposition, epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD nitride, PECVD nitride Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining with KOH anisotropic etch, backside sputter depositions of Ti/Ni/Ag, gold deposition, gold alloy, lift off processes, Ti/Pt/Au lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by tri-metal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump, wafer probing, dicing services, wafer saw, package development, solid via packages, packaging and test services, failure analysis services, SEM, scanning electron microscopy, ellipsometer measurements, four point probe measurements. For more information follow Hte Labs link.

Hyperion Group

Hyperion Group Corporation is committed to development of advanced  semiconductor, microwave and RF technologies. Hyperion group offers discrete and integrated circuits as well as thin film circuits and microwave components. Hyperion Group also offers bipolar and bicmos wafer foundry as well as shared manufacturing through its wafer fabs and laboratories. For more information follow Hyperion Group link.

Laser Trim Services

Laser Trim Services, LTS provides laser machining and laser trim services. For laser trim services, please check LTS for Laser trimming services , fast turn around, low cost custom laser trimming services of thin film resistors within our Research and Development Laboratories for semiconductor optoelectronics sensors microwave thin film active and passive components bipolar wafer foundry services. For more information follow Laser Trim Services link.

MEMS Foundry

MEMS Foundry offers MEMS foundry Services from single process steps in our MEMS foundry wafer fabrication to full turnkey mems product development from mems design concept through mems volume production, mems test and mems packaging. Mems manufacturing using Bipolar and CMOS Wafer Foundry, mems ASIC Design with SiCr, NiCr and TaN precision Thin Film Resistors - Research and Development Laboratories for semiconductor optoelectronics sensors microwave thin film active and passive components Research and Development Laboratories for semiconductor optoelectronics sensors microwave thin film active and passive components Mems Foundry provides process specialties bipolar wafer foundry, BICMOS wafer foundry, thin film vacuum deposition services, applied thin film processing for analog and mixed signal bipolar manufacturing processes, Analog CMOS wafer foundry, R&D support, research and development support for microelectronics and process specialties wafer Fab processing to customers from semiconductors and microelectronics industry. Bipolar wafer foundry includes the following processes: 20V bipolar process,45V bipolar process,75V bipolar process,25V super-beta bipolar process and high voltage dielectric isolated bipolar processes. R&D support is provided in the following fields of microelectronics: test and measurement, medical instrumentation, industrial process control and communications, thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), MEMS technology, smart sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications including SAW, Ti diffusion, light wave guides and Mach-Zender light modulators. Specialty wafer Fab processing: epi deposition, epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD nitride, PECVD nitride Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining with KOH anisotropic etch, backside sputter depositions of Ti/Ni/Ag, gold deposition, gold alloy, lift off processes, Ti/Pt/Au lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by tri-metal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump, wafer probing, dicing services, wafer saw, package development, solid via packages, packaging and test services, failure analysis services, SEM, scanning electron microscopy, ellipsometer measurements, four point probe measurements. For more information follow MEMS Foundry link.

Qbit Box

QBITBOX is used to store all your files easily and access them from one place. Access files from your browser. Browse files and share/download them from online. Access your files online from any device that is connected to internetA single place to upload and keep all your files from all your devices. QBITBOX is not  BOX or DROPBOX. It backs up files from each individual computing device. You will never loose information. You will never have wrong version of a file.Sign up now and get 10GB Online Storage for life. For more information follow Qbit Box link.

Quantum Labs

Quantum Labs is using classical and quantum physical sciences in exploring the limits of the fabrication of nanometer-scale electronic and opto-electronic structures and the measurement and understanding of their fundamental properties. Quantum Labs research into nano-electronics is aimed at exploring the limits for the power efficiency and speed of computation which is expected by many to be an improvement of a factor of at least one billion beyond the presently known capabilities of silicon integrated circuits. Quantum Labs is open to researchers with broad range of academic disciplines, including computer science, solid state physics, electrical engineering, materials science and chemistry. For more information follow Quantum Labs link.

Quantum Photonics

Quantum photonics technology is an emerging technology that will help bring new advances in telecommunications. Faster and higher power light pulses coupled with better control over light-detector interactions will enable new types of communications solutions not possible with older photonics technology.
Within Microprocessor technology, core-to-core communication will be enhanced from multi-core to many-core communications. Each core operates at speeds of tens of gigabits per second, an intra-chip interconnect will have to be able to handle speeds of several hundred gigabits per second, or even terabits per second. Photonic interconnection will achieve ultra-high speeds due to teh fact that light signal propagation mechanism is much faster when is compared to the electrical one while solving crosstalk due to signal interference at much lower power consumption. For more information follow Quantum Photonics link.

Power Resistors

Semiconwell is a manufacturer of custom precision power resistors. SWRPxxW TO220 series are high precision and high power resistors encapsulated in the TO-220 package. Power resistors are manufactured in 20W, 25W, 30W, 35W, 50W and 60W. Resistance element is electrically insulated from metal heat sink mounting tab. When properly mounted Semiconwell's SWRPxxW TO220 packaged power resistors provide up to 60 watts of steady state power. These very low inductance resistors are ideal for many industrial applications: power supplies, power controls and inrush/bleeder resistors.
Semiconwell thin film power resistors are manufactured by depositing continuous and defect free metallic films conferring long-term stability, very low TCR, very low current noise and negligible non-linearity.
Semiconwell thin film power resistors are price competitive while outperforming the thick film power resistors currently used in high power applications. For more info as how thin film resistors compare with thick film resistors, see SWAN04. For more information follow Power Resistors link.

Scientific Equipment LLC

Scientific Equipment LLC offers a wide range of custom developed process equipment used in semiconductor manufacturing industry. Scientific Equipment LLC works with customers to develop new technologies and builds the necessary equipment for transferring processes from R&D phase to prototype and high volume manufacturing. Scientific Equipment LLC engineers are inventing new equipment and green technologies to support semiconductor manufacturers worldwide. Scientific Equipment LLC offers also refurbished equipment that is remanufactured to original specifications or modified to satisfy customer-desired specifications. For more information follow Scientific Equipment LLC link.

Semiconix

SEMICONIX has undertaken the task to redesign and manufacture the future semiconductor components compatible with chip and wire, flip chip, chip scale CSP and surface mount Gold Chip technology.. In today's extreme miniaturization market, there is no more room for the large packages to protect the die. It means that the bare die has to survive on its own without the protection of a package. Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. The solution developed by Semiconix for known good die for bare die applications is gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix designs and manufactures standard and custom semiconductor components for medical, wireless telecommunications, opto-electronics, computing, military and space applications. For more information follow Semiconix link.

Semiconwell

Semiconwell manufactures passive network components, integrated active and passive devices, resistor networks, capacitor networks, schottky and zener diode networks, and npn, pnp transistors arrays that perform the following functions: series and parallel linear and nonlinear GTL, AC, Diode, Thevenin termination networks, precision thin film resistor capacitor networks (RC networks), isolated, bussed resistor networks including zero Ω jumper arrays, voltage divider networks, resistor networks for audio applications, EMI, RFI and ESD zener clamped diodes and transient voltage suppressors networks, EMI/RFI filter networks and clock terminations. Semiconwell's proprietary semiconductor technology, advanced thin films processes, in house assembly and packaging technologies allow manufacturing of flip chip CSP chip scale and MLF molded lead frame surface mount integrated passive networks that include unprecedented large capacitors >1microfarad (1µF) and giga Ω resistors (GW). For more information follow Semiconwell link.

SMX Semiconductors

SMX SEMICONDUCTORS has undertaken the task to redesign and manufacture the future semiconductor components compatible with chip and wire, flip chip, chip scale CSP and surface mount technologies. In today's extreme miniaturization market, there is no more room for the large packages to protect the die. It means that the bare die has to withstand harsh environmental conditions without the protection of a package. Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. The solution developed by Semiconix for known good die for bare die applications is GOLD CHIP TECHNOLOGY™, i.e. gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix designs and manufactures standard and custom semiconductor components for medical, wireless telecommunications, opto-electronics, computing, military and space applications. For more information follow SMX Semiconductors link.

Thin Film Circuits

Thin-Film-Circuits Fabrication Technology has Complete In-House Thin-Film Circuit Fabrication Service, Pattern Generated Photomasks, In-House Resistor Laser Trimming and CO2 Laser Drilling, Multiple Sputtering Systems and Plating Capabilities, Air Bridges/Crossovers, Wide Selection of Materials and Metallizations, Hollow Plated and Solid Filled Via Capabilities, AL2O3, ALN, BeO, Fused Silica, Quartz, Sapphire and Hi-K Dielectrics, Quick Turn Engineering Prototypes, Pre-deposited Gold/Tin (Au/Sn), High-Rel Screening: Bond Pull, Die Shear, Temp Shock, Temp Cycle, Burn In per MIL-PRF-38534 For more information follow Thin Film Circuits link.

US Microwaves

US Microwaves is a manufacturer of high reliability microwave integrated circuits technology or MIC technology. US Microwave offers a multitude of applied thin film products and microwave semiconductor devices: manufactures and supplies high quality standard microwave thin film circuits and microwave devices using advanced technical ceramics and semiconductor materials; Products include RF micro devices  for hybrid chip and wire applications; microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky diodes, PIN diodes, tunnel diodes, SRD diodes, varactor diodes and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe. For more information follow US Microwaves link.

 


Hyperion Group  GLOSSARY OF TECHNICAL & SCIENTIFIC TERMS used on this website
 

Active base Adhesion, adhesion promoter Ag, see silver Air annealing, air firing Al, aluminum, aluminum deposition, aluminum etch, aluminum film, aluminum metallization, aluminum sputtering AlN, Aluminum nitride metallized substrate Al2O3, aluminum oxide, alumina Alloying Ammonium fluoride etching solution Amorphous silicon, a:Si Anisotropic etching Annealing, nitrogen, air Anodization solution As, Arsenic implant, arsenic diffusion, arsenic doped silicon Antimony, Antimony diffusion, Antimony implant, Sb implant, antimony doped silicon Ar, argon sputter clean, sputter etch Ashing Au, Au-Ge, Au-In, Au-Si, Au-Sn Avalanche Breakdown

Backlap and polish, backlaping Barrel etch reactor, LFE Base contact, base diffusion, base junction, base implant, base mask, base oxide, base resistance Beam leads Be, Beryllium, BeO, Beryllium Oxide Bevel and stain epitaxial layer thickness measurement BHF, buffered hydrofluoric etching, BOE, buffered oxide etch Bipolar transistor, bipolar process, bipolar foundry, bipolar wafer, bipolar device, bipolar integrated circuit Bird beak and bird crest BJT, bipolar junction isolated transistors Bonding pad, Bond pad B, Boron implant, Boron doped oxide, Boron doped silicon Bipolar process Bipolar transistor, bipolar transistor doping profile, bipolar wafer foundry Breakdown voltage, BVcbo, BVceo, BVebo, BVsd, BVgd Bump, gold bump process, underbump metallization Buried layer, buried collector

Capacitance, junction capacitance, parasitic capacitance Carrier concentration Capacitors, MOS, MNOS, MIS, MIM CF4 plasma etch Channel stop, ion implanted channel stopper, channel implant Chemical etchants, chemical etch of metals, chemical etch of silicon, chemical etch of oxide Chip, chip capacitor, chip inductor, chip resistor Cleaning, diffusion cleaning, tube cleaning Cl, Chlorine oxidation, plasma etch Contract fabrication Cr, Chromium sputter deposition, etch, masks Certificate of conformance Class 10 clean room, Class 10 laminar flow hood CMOS, complimentary metal oxide semiconductor Collector contact, collector diffusion, collector junction, collector implant, collector mask, collector oxide, collector resistance Complimentary bipolar process, transistors Complimentary bipolar process, Complimentary bipolar foundry, Complimentary bipolar wafer, Complimentary bipolar integrated circuit Contacts to silicon, silicide, resistor film, contact etch, contact printing, contact resistance Cu, copper film, copper deposition, copper electroplating, copper etch, copper sputtering, copper metallization Copper displacement plating solution CP-4, CP-6, CP-8 etchants, composition, etch rates C-V measurement CZ silicon, Czochralski grown silicon

DC Magnetron sputtering Dehydration, Dehydration oven, dehydration treatment Depletion mode transistors, depletion layer width Deposition, deposition services Deposited films, deposited metals, deposited nitride, deposited oxides, deposited silicon Deposition rate, sputtering, PECVD, LPCVD, electroplating Design Device design, device manufacturing, device processing, device reliability DI water, deionised water Dielectrics, dielectric films, dielectric constant of materials Diamond like film deposition Dicing saw, wafers, ceramic, quartz Die bonding, die attach, die attach eutectic Dielectric constant of various common ceramic materials Dielectric depositions, reactive sputtered dielectric deposition, PECVD dielectric deposition, spin on glass Die Dicing, see sawing Diffused capacitors, diffused diodes, diffused junctions, diffused resistors Diffusion, diffusion cleaning, diffusion layer, ion implanted source, lateral diffusion, open tube, diffusion doping profile Diffusion furnace operating conditions, ramping rates, diffusion and oxidation Diffusion tube, diffusion tube cleaning, diffusion cleaning, diffusion preclean Diodes, diffused diodes, junction diodes, photo diodes, schottky diodes, zenner diodes doping profile Discrete semiconductor components DMOS Doped Oxide, Doped polysilicon, silicon Doping, vapor phase doping, in situ doping, ion implant doping Doping profile of bipolar transistors, doping profile of diffused junctions Dry oxidation of silicon, dry oxide

Electromigration Electron mobility Electroplating, electroplating solution Ellipsometer Emitter ballasted transistor Emitter diffusion, emitter push effect, emitter implant, emitter mask, emitter oxide, emitter resistance, emitter washout process Enhancement mode transistors Epi deposition, Epitaxy, epitaxial devices, epitaxial deposition, epitaxial layers, epitaxial layer thickness measurement epitaxial layer pattern shift and pattern distortion Erfc diffusion, erfc profile Etch, Etching, anisotropic, isotropic etching, etch profile Etchants for oxide, nitride, metals Etch rates for plasma etch, etch rates for wet etch, etch rate for sputter etch process Eutectic, eutectic die attaching

Fe2O3, see iron oxide Field effect transistor Field implant, field oxide Film, films, film deposition, film deposition conditions, sputtering, LPCVD, PECVD Film properties of oxides, film properties of nitride Fixed oxide charge Float zone silicon Fluorine gas plasma etch of Si, SiO2, Si3N4, metals Four point probe measurement, 4pp instrument, 4pp measurements Four-point probe method Fundamental constants Furnace operating conditions, ramping rates and insertion rates FZ, float zone silicon

Gain bandwidth product Ga, Gallium, Gallium arsenide, GaAs, GaAs processing Gas, Gases, gas plasma etch, gas supply, gas distribution, gas phse deposition Gaussian diffusion profile Gate, Gates, see MOS gates, Schottky gates Germanium, Ge Gettering, gettering of heavy metals via Chlorine oxidation Glass substrates, glass deposition Gold deposition, gold doping, gold films, gold etch, gold electroplating, gold diffusion, gold sputtering, gold alloying Gold bump process Grain boundary, Polysilicon grain boundary Guard ring diffusion, guard ring implant, guard ring layout design

Hall effect, hall mobility, hall sensors Halogen, halogen plasma etch, halogenic oxidation Heavy doping Hexamethyldisilizane, see HMDS Heteroepitaxy High resistivity silicon, FZ, float zone silicon High resistivity water High temperature annealing Hillocks Hole mobility Horizontal reactor Hot wall reactor Hydrogen, Hydrogen anneal, Hydrogen diffusion, hydrogen flow HCl, hydrogen chloride etch, hydrogen chloride oxidation HF, hydrogen fluoride etching solution NH4F ammonium fluoride etching solution Hydrophobic surface HMDS, HMDS spin coating, HMDS adhesion promoter Hyperabrupt junction diodes, Hyperabrupt profile, Hyperabrupt Schottky diodes

Image reversal photoresist Implant, Implanted resistors Impurity concentration, impurity diffusion, impurity gradient, impurity profile, impurity redistribution Index of refraction In-situ etching, in-situ doping, in-situ cleaning Integrated circuit process sequence Interconnections, single metal interconnections, double metal interconnections Interstitial Intrinsic carrier concentration, intrinsic gettering Iodine, Iodine etch, KI solution Ion dose, Ion implant, ion implantation, ion implant activation, ion implant doping profile, implant dose, ion implantation Ion implanted JFET Ion implanted buried layer, Ion implanted collector, ion implanted base, ion implanted emitter Ion implanted source, Ion implanted Drain Ion implanted resistor IPA, IPA dry, Isopropyl alcohol Iron Iron oxide film, iron oxide deposition, iron oxide masks ISO 9000 compliance, ISO 9000 compliant Isolation, isolation diffusion, isolation mask

JFET, J-FET diffused Junction curvature, junction delineation, junction diffusion, junction depth, junction formation, junction isolation, junction lag, junction staining Junction diode, junction field effect transistor

K, see potassium hydroxide KOH, KOH etch, KOH anisotropic etch, KOH silicon etch KTFR, see negative resist, negative photoresist

Laminar flow, laminar flow hood Laser Laser trim Laser trimming Laser resistor trimming Laser thin film resistors trimming Laser thin film resistors trimming services Laser ablation Laser annealing Laser drilling Laser cutting Laser machining Lateral diffusion, lateral spread Lateral p-n-p transistor, lateral PNP transistors Lifetime Lift-off process Linear oxidation rate constant LiNbO3 process Layout design Loading effect Local oxidation, LOCOS, Locally oxidized transistor Low reverse gain transistors LPCVD epitaxial deposition, LPCVD epitaxial process LPCVD nitride deposition, LPCVD nitride process LPCVD oxide deposition, LPCVD oxide process LPCVD Polysilicon deposition, LPCVD Polysilicon process Low pressure chemical vapor deposition Low pressure reactor

Magnetron Mask, mask design, mask manufacturing, manufacturing borosilicate mask, chrome mask, low reflectivity chrome mask, e-beam mask, emulsion mask, iron oxide mask, see through mask, silicon mask, sodalime glass mask, master mask, reticle, working mask Mask alignment, mask alignment keys Masking Mass flow controller Measurement, 4pp measurement, sheet resistance measurement, thickness measurement, refractive index measurement Measurement of resistivity MEMS, MEMS contract fabrication, MEMS process development, MEMS wafer foundry Mesa etch, mesa isolation MESFET Metallization and Lift-off, multi-layer metallization, single-layer metallization, multi-level metallization, single-level metallization Metal, Metals deposition, metal films, metal etch, metal mask, metal patterning Metal oxides, metal nitrides, metal silicides Metalorganic Metals refractory Metal Oxide Semiconductor, MOS, MOS transistor, MOSFET Metal semiconductor junction, Schottky barrier diode Military standard, MIL 883 MNOS transistors Mobility Molecular beam epitaxy Mo, Molybdenum, Molybdenum deposition, molybdenum sputtering, molybdenum film, molybdenum etch, molybdenum gate, molybdenum metallization, molybdenum interconnection layer MOS, MOSFET MOS capacitor, MOS devices, MOS transistor Multi-emitter transistor, multiple diodes, multiple implants

Narrow slot, diffusion N-channel transistor Nitrogen annealing, nitrogen flow NMOS Non volatile memory NPN transistor n+ - p - n+ transistor

Ohmic contact, ohmic contacts to silicon, ohmic contacts to silicides Optical mask, optical printing, optical printer Optoelectronic application, optoelectronic devices Organometalic Orientation of silicon, orientation effects Overetch Oxidation, oxidation rate, Oxidation-induced stacking faults, oxidation tube, oxidation furnace Oxide deposition, oxide etch, oxide isolation, oxide isolated Oxide color chart, oxide masking properties, oxide growth rate, oxide isolation Oxygen, oxygen plasma, oxygen flow

Pad oxide and silicon nitride deposition, bird beak and bird crest Palladium, Palladium deposition, Palladium sputtering, Palladium film, Palladium etch, Palladium metallization, Palladium silicide Parabolic oxidation rate constant Parasitic capacitance, parasitic junction Partial pressure Paper less Passive components Pattern, pattern delineation, pattern generation, pattern shift, pattern distortion P-channel JFET, p-channel transistor Pd, Palladium, Palladium deposition, Palladium sputtering, Palladium film, Palladium etch, Palladium metallization, Palladium silicide PECVD see plasma enhanced chemical vapor deposition, PECVD Nitride deposition, PECVD Oxide deposition, PECVD amorphous silicon deposition Penetration depth, ion implant depth Peritectic reaction Permalloy Permeability Phosphoric acid etch of silicon nitride, Phosphoric acid and aluminum etch, H3PO4 Phosphorus, Phosphorus diffusion, Phosphorus ion implant, Phosphorus doped silicon, Phosphorus doped glass Phosphosilicate glass Photolithography Photoresist, photoresist coating, photoresist masking, negative photoresist, positive photoresist, photoresist removal, photoresist strip, photoresist ashing, photoresist develop, photoresist expose, photoresist soft bake, photoresist hard bake, photoresist adhesion, photoresist UV flood exposure, photoresist image reversal Pinch off voltage Pinch resistor Planar process, planar technology, planar junction, planar reactor, planar plasma etch reactor, planarization Plasma, plasma anodization, plasma ashing, plasma assisted etching, plasma etch, plasma etching, plasma clean, plasma reactor Plasma Enhanced chemical vapor deposition, see PECVD, Nitride deposition, PECVD Oxide deposition, PECVD amorphous silicon deposition Plating, plated gold, plated copper, plated silver, plating solution Platinum, see Pt, Platinum deposition, Platinum sputtering, Platinum film, Platinum etch, Platinum metallization, Platinum silicide pn junction PNP transistor Polycrystalline silicon Polishing, Polishing etch, polished wafers, polished ceramic, polished silicon, polished quartz wafers, polished glass wafers Polyimide Polysilicon emitter, Polysilicon deposition, Polysilicon sputter deposition, Polysilicon oxidation, Polysilicon doping, Polysilicon etching, Polysilicon anisotropic plasma etching, LPCVD undoped polysilicon deposition, Polysilicon gate, Polysilicon growth Positive resist, positive photoresist Printing, contact printing, optical printing, projection printing, proximity printing, printing defects Process control, process development, process flow, process run sheet, process run traveller, process work sheet Projected range and ion implantation Projection printing Proximity printing PSG, see Phosphorus doped glass Pt, see Platinum, Platinum deposition, Platinum sputtering, Platinum film, Platinum etch, Platinum metallization, Platinum silicide Purple plague and gold aluminum intermetallics Pyrogenic oxidation process, Pyrogenic oxide

Quality, Quality audit, Quality manual, Quality system Quartz, Quartz boat, Quartz deposition, quartz mask, Quartz polishing, Quartz tube, Quartz substrate, Quartz wafer

R&D, R&D contract, R&D facility, R&D support, R&D wafer fab, R&D wafer foundry Radial resistivity Ramping rate Reactive ion etching, see RIE Reactive sputtering Reactor, barrel reactor, low pressure reactor, planar reactor, tunnel reactor Refractive index measurement Refractory metals Reflow methode, reflow of doped oxide, reflow of photoresist Registration between mask layers Reliability, reliable metallization, reliable process Research and development contract, Research and development facility, Research and development support, Research and development wafer fab, Research and development wafer foundry Residual film stress Resist, see photoresist Resistance Resistor, resistors, diffused resistors, implanted resistors, thin film resistors, pinch resistors, resistor trim Resistivity, resistivity measurement, resistivity versus temperature, see TCR Reticle, reticle mask, see also mask stepper RF magnetron, RF plasma etch RIE, see reactive ion etching also Rsq, sheet resistance measurement Run sheet Run traveler Runsheet

Sapphire, Sapphire substrate, Sapphire polishing, Sapphire dicing Saw, sawing, sawing process, sawing service Scribe line, scribing Sealed junction technology Selective epitaxy, selective etching Se, Selenium Self aligned gate process, self alignment, self aligning method Self isolated transistor, self isolation Semiconductor, semiconductor components, semiconductor equipment, semiconductor processing, semiconductor services Semi-insulating Shallow diffusion, shallow junction, shallow implant, shallow impurities Silane, SiH4 SiC, silicon carbide, silicon carbide deposition SiCr, sichrome films, sichrome deposition SiN, Si3N4 Silica glass, silica etch, see oxide etch Silicon components Silicon integrated circuits SiO2, SiO, SiOxNy, SIPOS Silicide etch, silicide growth, silicide oxidation, silicide properties Silicides, Ti, Ta, Pt, Mo Silicon dioxide, Silicon dioxide etch, Silicon dioxide plasma etch, Silicon dioxide deposition Silicon nitride, silicon nitride deposition, silicon nitride etch rate, silicon nitride film properties, silicon nitride refractive index Silicon anisotropic etches, see KOH etch and plasma anisotropic etch of silicon and polysilicon Silicon annealing, silicon anodization, silicon cleaning, silicon cleaving, silicon crystallographic etches, silicon etch rates Silicon polishing etches Silicon denuded zone formation Silicon dioxide, SiO2, Silicon dioxide etch, Silicon dioxide film, Silicon dioxide growth, Silicon dioxide deposition Silicon dioxide reactive sputter deposition, Silicon dioxide PECVD deposition, Silicon dioxide LPCVD deposition Silicon dioxide refractive index, Silicon dioxide color chart, Silicon dioxide dielectric properties, Silicon dioxide plasma etch Silicon dioxide anisotropic plasma etch, Silicon dioxide BOE etch, Silicon dioxide BHF etch Silicon nitride, SiN, SixNy, Si3N4, Silicon nitride, SiO2, Silicon nitride etch, Silicon nitride film, Silicon nitride growth, Silicon nitride deposition, Silicon nitride reactive sputter deposition, Silicon nitride PECVD deposition, Silicon dnitride LPCVD deposition Silicon nitride refractive index, Silicon nitride color chart, Silicon nitride dielectric properties, Silicon nitride plasma etch Silicon nitride anisotropic plasma etch, Silicon nitride H3PO4 etch, Silicon nitride phosphoric acid etch, Silicon nitride HF etch Silicon on sapphire Silicon oxynitride Silver deposition, Silver bump, Silver films, Silver etch, Silver electroplating, Silver sputtering Schottky, Schottky barrier diodes, Schottky barrier junction, Schottky contacts, Schottky defects, Schottky clamp diodes, Schottky cleaning, Schottky films, Hyperabrupt Schottky diodes Schottky clamped process Sheet resistance measurement, base sheet resistance, emitter sheet resistance, epi layer sheet resistance Sn see tin deposition SnO2 see tin oxide deposition SnPb 60-40 see tin-lead deposition Sodium gettering, sodium passivation Solid solubility SOS transistors, SOS process Source - drain contacts, Source - drain layout, Source - drain diffusion, Sorce - drain implant SPC, see statistic process control Sputter cleaning sputter deposition Sputtering, sputtering yields Sputtered films, sputtered aluminum, sputtered aluminum nitride, sputtered copper, sputtered chrome, sputtered gold, sputtered iron oxide, sputtered molybdenum, sputtered nickel, sputtered nickel - chrome, sputtered nickel - vanadium, sputtered silicon, sputtered silicon nitride, sputtered silver, sputtered tin, sputtered tin oxide, sputtered tin lead, sputtered titanium, sputtered tantalum, sputtered tantalum silicide, sputtered tantalum nitride, sputtered tungsten, sputtered zirconium Stacking fault method, Stacking faults, Stacking fault etch Statistic process control Steam oxidation Step coverage Step junction Step and repeat Stepper Stirring Stress Substrate holder, Sulfur hexafluoride plasma etch Superbeta transistors Surface barriers metal semiconductor, surface charge, surface resistivity Surface concentration, surface inversion, surface mobility, surface reflectivity Susceptor

Ta, Tantalum, Tantalum deposition, Tantalum sputtering, Tantalum film, Tantalum etch, Tantalum metallization, Tantalum silicide TaN, Tantalum Nitride deposition, Tantalum Nitride sputtering, Tantalum Nitride film, Tantalum Nitride etch Tantalum Nitride Thin film resistors TaSi2, Tantalum Silicide deposition, Tantalum Silicide sputtering, Tantalum Silicide film, Tantalum Silicide etch Tantalum Silicide thin film resistors Ta TiW Au TaN TiW Au Te, Tellurium deposition, ......... Thermocompression bonding Thin film resistors deposition, thin film resistors plasma etch, thin film resistors lift-off process, thin film resistors patterning Thin film resistors stabilization process, thin film resistors annealing process, thin film resistors process Ti, Titanium, titanium deposition, titanium etch, titanium silicide, titanium silicidation TiN, titanium nitride deposition, titanium nitride properties, titanium nitride wet etch, titanium nitride plasma etch TiW, titanium-tungsten deposition, titanium-tungsten properties, titanium-tungsten wet etch, titanium-tungsten plasma etch Ti Ni Ag Ti NiV Ag Ti Pd Au Ti Pt Au TiW Au TiW TiWNx TiW Au TCR, see thermal coefficient of resistance Thermal coefficient of resistance Thermal oxide, thermal oxidation, thermal anneal, thermal processing, thermal treatment Thin film deposition, thin film sputter deposition, thin film sputtering deposition, thin film devices, thin film resistors Thickness measurement Threshold voltage Transistor, bipolar transistor, emitter ballasted transistor, field effect transistor, low reverse gain transistor, MOS transistor, multi-emitter transistor, self-isolated transistor, superbeta transistor, NPN transistor, PNP transistor, lateral PNP transistor, vertical NPN transistor, vertical PNP transistor, TMOS transistor, Triply diffused transistor Triply diffused process Tube, tube cleaning, diffusion tube cleaning Tungsten, W, tungsten sputtering deposition, tungsten etch, tungsten silicide, tungsten silicidation Tungsten nitride, WNx, tungsten nitride deposition, tungsten nitride reactive sputtering deposition, tungsten nitride properties, tungsten nitride wet etch, tungsten nitride plasma etch Tunnel reactor Twin tabs, twin diffusion tabs Two-step diffusion

Ultrasonic bonding Ultrasonic cleaning Undercut Universal constants UV exposure, UV flood exposure

V/I, 4pp measurement of V/I Van der Pauw, Van der Pauw measurement, Van der Pauw structure design Vapor dry in IPA, IPA dry, Isopropyl alcohol vapor dry Vendor, vendor quality system audit VMOS Vertical NPN transistors Vertical PNP transistors Vertical reactor Voltage breakdown, BVcbo, BVceo, BVebo, BVsd, BVgd

W, tungsten, W PtSi Si Wafer bumping process, services Wafer cleaning procedures Wafer dicing Wafer fab, wafer fabrication, wafer process, wafer processing Wafer foundry Wafer thinning, wafer thinning process, wafer thinning procedure Washout, washout emitter, emitter washout process Water, DI water, deionised water, high resistivity water Wet etch, wet etching, wet anisotropic etch Wet oxide, wet oxidation process Work in progress, WIP Work sheet Working mask

X-ray printing, Xe, Xenon

Yield, Yield enhancement, Yield specification

Zinc, Zn ZnO, zinc oxide Zr, Zirconium Zenner diodes Zero bias diode, ZBD

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  HYPERION GROUP AVIONICS AUTOMOTIVE COMMUNICATIONS DEFENSE MEDICAL SPACE TECHNOLOGY SOLUTIONS  
  HYPERION GROUP GOLD CHIP TECHNOLOGY Space Semiconductor Technology FOR THE FUTURE  
 
     
HYPERION GROUP GOLD CHIP TECHNOLOGY FOR THE FUTURE

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HYPERION GROUP Companies, design and manufactures standard and custom semiconductor components for avionics, automotive, communications, computing, defense, medical, military, optoelectronics, telecommunications, space and  wireless applications.
HYPERION has undertaken the task to redesign and manufacture the future semiconductor components compatible with chip and wire, flip chip, chip scale CSP and surface mount technologies. In today's extreme miniaturization market, there is no more room for the large packages to protect the die. It means that the bare die has to survive on its own without the protection of a package. Known Good Die is useless if the die cannot withstand harsh environmental conditions and degrades. The solution developed by HYPERION for known good die for bare die applications is gold interconnection and well-engineered materials that further enhance the die reliability.

 
   
   
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