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HYPERION
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AVIONICS
AUTOMOTIVE
COMMUNICATIONS
DEFENSE
MEDICAL
SPACE
TECHNOLOGY
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HYPERION GROUP GOLD CHIP TECHNOLOGY FOR
THE FUTURE |
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HYPERION GROUP Companies, design
and manufactures standard and custom semiconductor components for
avionics, automotive, communications, computing, defense, medical,
military, optoelectronics, telecommunications, space and
wireless applications.
HYPERION has undertaken the task to redesign and manufacture the
future semiconductor components compatible with chip and wire, flip
chip, chip scale CSP and surface mount technologies. In today's
extreme miniaturization market, there is no more room for the large
packages to protect the die. It means that the bare die has to
survive on its own without the protection of a package. Known Good
Die is useless if the die cannot withstand harsh environmental
conditions and degrades. The solution developed by HYPERION for
known good die for bare die applications is gold interconnection and
well-engineered materials that further enhance the die reliability.
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HYPERION |
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Hyperion Group Companies
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Hte Labs
HTE Labs provides process
specialties bipolar wafer foundry, BICMOS wafer foundry, thin film
vacuum deposition services, applied thin film processing for analog
and mixed signal bipolar manufacturing processes, Analog CMOS wafer
foundry, R&D support, research and development support for
microelectronics and process specialties wafer Fab processing to
customers from semiconductors and microelectronics industry. Bipolar
wafer foundry includes the following processes: 20V bipolar
process,45V bipolar process,75V bipolar process,25V super-beta
bipolar process and high voltage dielectric isolated bipolar
processes. R&D support is provided in the following fields of
microelectronics: test and measurement, medical instrumentation,
industrial process control and communications, thin film active and
passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb),
MEMS technology, smart sensor technologies (inertial, pressure,
temperature, gas and smoke detectors), optoelectronic technologies
and components, discrete and integrated circuits technology
development for special applications, LiNbO3 applications including
SAW, Ti diffusion, light wave guides and Mach-Zender light
modulators. Specialty wafer Fab processing: epi deposition, epitaxy,
SiGe, epi, diffusion and oxidation, ion implant, LPCVD nitride,
PECVD nitride Si3N4, SiO2, platinum silicidation, photo-lithography,
plasma etching, silicon micro-machining with KOH anisotropic etch,
backside sputter depositions of Ti/Ni/Ag, gold deposition, gold
alloy, lift off processes, Ti/Pt/Au lift off process, sputter
depositions of thin film resistors : SiCr, NiCr, TaN2, silicon
wafers back grind and polish followed by tri-metal backside sputter
depositions, gold backside sputter depositions and alloy : gold
electroplating and gold bump, wafer probing, dicing services, wafer
saw, package development, solid via packages, packaging and test
services, failure analysis services, SEM, scanning electron
microscopy, ellipsometer measurements, four point probe
measurements. For more information follow Hte Labs link.
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Hyperion Group
Hyperion Group Corporation is
committed to development of advanced semiconductor, microwave and RF technologies. Hyperion
group offers discrete and integrated circuits as well as thin film
circuits and microwave components. Hyperion Group also offers
bipolar and bicmos wafer foundry as well as shared
manufacturing through its wafer fabs and laboratories. For more information follow
Hyperion Group link.
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MEMS Foundry
MEMS Foundry offers MEMS foundry
Services from single process steps in our MEMS foundry wafer
fabrication to full turnkey mems product development from mems
design concept through mems volume production, mems test and mems
packaging. Mems manufacturing using Bipolar and CMOS Wafer Foundry,
mems ASIC Design with SiCr, NiCr and TaN precision Thin Film
Resistors - Research and Development Laboratories for semiconductor
optoelectronics sensors microwave thin film active and passive
components Research and Development Laboratories for semiconductor
optoelectronics sensors microwave thin film active and passive
components Mems Foundry provides process specialties bipolar wafer
foundry, BICMOS wafer foundry, thin film vacuum deposition services,
applied thin film processing for analog and mixed signal bipolar
manufacturing processes, Analog CMOS wafer foundry, R&D support,
research and development support for microelectronics and process
specialties wafer Fab processing to customers from semiconductors
and microelectronics industry. Bipolar wafer foundry includes the
following processes: 20V bipolar process,45V bipolar process,75V
bipolar process,25V super-beta bipolar process and high voltage
dielectric isolated bipolar processes. R&D support is provided in
the following fields of microelectronics: test and measurement,
medical instrumentation, industrial process control and
communications, thin film active and passive components
technologies, flip chip technology (TiW/Cu/Cu/SnPb), MEMS
technology, smart sensor technologies (inertial, pressure,
temperature, gas and smoke detectors), optoelectronic technologies
and components, discrete and integrated circuits technology
development for special applications, LiNbO3 applications including
SAW, Ti diffusion, light wave guides and Mach-Zender light
modulators. Specialty wafer Fab processing: epi deposition, epitaxy,
SiGe, epi, diffusion and oxidation, ion implant, LPCVD nitride,
PECVD nitride Si3N4, SiO2, platinum silicidation, photo-lithography,
plasma etching, silicon micro-machining with KOH anisotropic etch,
backside sputter depositions of Ti/Ni/Ag, gold deposition, gold
alloy, lift off processes, Ti/Pt/Au lift off process, sputter
depositions of thin film resistors : SiCr, NiCr, TaN2, silicon
wafers back grind and polish followed by tri-metal backside sputter
depositions, gold backside sputter depositions and alloy : gold
electroplating and gold bump, wafer probing, dicing services, wafer
saw, package development, solid via packages, packaging and test
services, failure analysis services, SEM, scanning electron
microscopy, ellipsometer measurements, four point probe
measurements. For more information follow MEMS Foundry link.
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Quantum Labs
Quantum Labs is using classical
and quantum physical sciences in exploring the limits of the
fabrication of nanometer-scale electronic and opto-electronic
structures and the measurement and understanding of their
fundamental properties.
Quantum Labs research into nano-electronics is aimed at exploring
the limits for the power efficiency and speed of computation which
is expected by many to be an improvement of a factor of at least one
billion beyond the presently known capabilities of silicon
integrated circuits.
Quantum Labs is open to researchers with broad range of academic
disciplines, including computer science, solid state physics,
electrical engineering, materials science and chemistry. For more information follow Quantum Labs link.
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Quantum Photonics
- coming soon
Quantum photonics technology is
an emerging technology that will help bring new advances in
telecommunications. Faster and higher power light pulses coupled
with better control over light-detector interactions will enable new
types of communications solutions not possible with older photonics
technology.
Within Microprocessor technology, core-to-core communication will be
enhanced from multi-core to many-core communications. Each core
operates at speeds of tens of gigabits per second, an intra-chip
interconnect will have to be able to handle speeds of several
hundred gigabits per second, or even terabits per second. Photonic
interconnection will achieve ultra-high speeds due to teh fact that
light signal propagation mechanism is much faster when is compared
to the electrical one while solving crosstalk due to signal
interference at much lower power consumption.
For more information follow Quantum Photonics link.
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Power Resistors
Semiconwell is a manufacturer of
custom precision power resistors. SWRPxxW TO220 series are high
precision and high power resistors encapsulated in the TO-220
package. Power resistors are manufactured in 20W, 25W, 30W, 35W, 50W
and 60W. Resistance element is electrically insulated from metal
heat sink mounting tab. When properly mounted Semiconwell's SWRPxxW
TO220 packaged power resistors provide up to 60 watts of steady
state power. These very low inductance resistors are ideal for many
industrial applications: power supplies, power controls and
inrush/bleeder resistors.
Semiconwell thin film power resistors are manufactured by depositing
continuous and defect free metallic films conferring long-term
stability, very low TCR, very low current noise and negligible
non-linearity.
Semiconwell thin film power resistors are price competitive while
outperforming the thick film power resistors currently used in high
power applications. For more info as how thin film resistors compare
with thick film resistors, see SWAN04.
For more information follow
Power Resistors link.
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Scientific
Equipment -
coming soon
Scientific Equipment LLC offers a
wide range of custom developed process equipment used in
semiconductor manufacturing industry. Scientific Equipment LLC works
with customers to develop new technologies and builds the necessary
equipment for transferring processes from R&D phase to prototype and
high volume manufacturing. Scientific Equipment LLC engineers are
inventing new equipment and green technologies to support
semiconductor manufacturers worldwide. Scientific Equipment LLC
offers also refurbished equipment that is remanufactured to original
specifications or modified to satisfy customer-desired
specifications. For more information follow Scientific Equipment LLC link.
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Semiconix
SEMICONIX has undertaken the task
to redesign and manufacture the future semiconductor components
compatible with chip and wire, flip chip, chip scale CSP and surface
mount Gold Chip technology.. In today's extreme miniaturization
market, there is no more room for the large packages to protect the
die. It means that the bare die has to survive on its own without
the protection of a package. Known Good Die concept is no longer
satisfactory if the die cannot withstand harsh environmental
conditions and degrades. The solution developed by Semiconix for
known good die for bare die applications is gold interconnection and
well-engineered materials that further enhance the die reliability.
Semiconix designs and manufactures standard and custom semiconductor
components for medical, wireless telecommunications, opto-electronics,
computing, military and space applications. For more information follow Semiconix link.
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Semiconwell
Semiconwell manufactures passive
network components, integrated active and passive devices, resistor
networks, capacitor networks, schottky and zener diode networks, and
npn, pnp transistors arrays that perform the following functions:
series and parallel linear and nonlinear GTL, AC, Diode, Thevenin
termination networks, precision thin film resistor capacitor
networks (RC networks), isolated, bussed resistor networks including
zero Ω jumper arrays, voltage divider networks, resistor networks
for audio applications, EMI, RFI and ESD zener clamped diodes and
transient voltage suppressors networks, EMI/RFI filter networks and
clock terminations. Semiconwell's proprietary semiconductor
technology, advanced thin films processes, in house assembly and
packaging technologies allow manufacturing of flip chip CSP chip
scale and MLF molded lead frame surface mount integrated passive
networks that include unprecedented large capacitors >1microfarad
(1µF) and giga Ω resistors (GW). For more information follow Semiconwell link.
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SILICON INCUBATOR
SILICON INCUBATOR is located in
Silicon Valley and helps startup companies to design and manufacture
standard and custom semiconductor and thin film components for
automotive, bio-medical, wireless telecommunications, optoelectronics,
computing, industrial, military, space and satellite applications.
Silicon incubator wafer fabrication facility offers a place where
startups can develop a mix of semiconductor technologies : silicon,
silicon carbide, gallium nitride, gallium oxide, aluminum nitride and
any other compound semiconductors. Silicon Incubator offers support to
any startup whose product needs semiconductor technology development and
the support of a wafer fabrication facility.
Once an innovative technology and product idea has been funded, the
startup faces the dilemma of finding the right wafer fabrication
partner. Cost of wafer fabrication facility is prohibitive and building
one from scratch takes time that will impact time to market. Unless the
product can be manufactured in a standard strictly digital process,
trying to partner with any billion dollar pure play wafer fabrication
facility is most of the time impossible and cost prohibitive. Once the
new product development and preproduction phase are complete, the
startup faces a new dilemma, that of finding a wafer foundry that will
accept the transfer of the new technology and manufacture its products.
The fables business model has backfired not only in Silicon Valley or
United States but throughout the world. There is an exponential
explosion of new products and technologies ideas that need a place to
materialize. There are few giants in the semiconductor industry that
have own fabrication facilities and there are few giant pure play
facilities, all at full capacity. The cost of semiconductor equipment
and its maintenance is very high and keeps rising. The number of hands
on semiconductor experts is getting smaller and cost of labor is getting
higher.
Silicon Incubator offers startups an interim solution, tools, guidance
and training so they can grow into a profitable business that can afford
to build own specialized wafer fabrication facility. For more information follow SILICON INCUBATOR link.
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SMX Semiconductors
SMX SEMICONDUCTORS has undertaken
the task to redesign and manufacture the future semiconductor
components compatible with chip and wire, flip chip, chip scale CSP
and surface mount technologies. In today's extreme miniaturization
market, there is no more room for the large packages to protect the
die. It means that the bare die has to withstand harsh environmental
conditions without the protection of a package. Known Good Die
concept is no longer satisfactory if the die cannot withstand harsh
environmental conditions and degrades. The solution developed by
Semiconix for known good die for bare die applications is GOLD CHIP
TECHNOLOGY™, i.e. gold interconnection and well-engineered materials
that further enhance the die reliability. Semiconix designs and
manufactures standard and custom semiconductor components for
medical, wireless telecommunications, opto-electronics, computing,
military and space applications. For more information follow SMX Semiconductors link.
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Thin Film Circuits
- coming soon
Thin-Film-Circuits
Fabrication Technology has Complete In-House Thin-Film Circuit
Fabrication Service, Pattern Generated Photomasks, In-House Resistor
Laser Trimming and CO2 Laser Drilling, Multiple Sputtering Systems
and Plating Capabilities, Air Bridges/Crossovers, Wide Selection of
Materials and Metallizations, Hollow Plated and Solid Filled Via
Capabilities, AL2O3, ALN, BeO, Fused Silica, Quartz, Sapphire and
Hi-K Dielectrics,
Quick Turn Engineering Prototypes, Pre-deposited Gold/Tin (Au/Sn),
High-Rel Screening: Bond Pull, Die Shear, Temp Shock, Temp Cycle,
Burn In per MIL-PRF-38534 For more information follow
Thin Film Circuits link.
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US Microwaves
US Microwaves is a manufacturer
of high reliability microwave integrated circuits technology or MIC
technology. US Microwave offers a multitude of applied thin film
products and microwave semiconductor devices: manufactures and
supplies high quality standard microwave thin film circuits and
microwave devices using advanced technical ceramics and
semiconductor materials; Products include RF micro devices for
hybrid chip and wire applications; microwave thin film circuits,
custom manufacturing from customer's data, spiral chip inductors -
ceramic, sapphire and quartz substrate, thin film resistors -
ceramic, silicon and quartz substrates, multi-tap thin film
resistors - ceramic and silicon substrates, capacitors MIS for chip
and wire applications, MNOS capacitors, MOS capacitors, ceramic
capacitors, Schottky diodes, PIN diodes, tunnel diodes, SRD diodes,
varactor diodes and zero bias diodes, RF NPN and PNP transistors,
high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe. For more information follow US Microwaves link.
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Hyperion Group GLOSSARY OF TECHNICAL &
SCIENTIFIC TERMS
used on this website
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Active base
Adhesion, adhesion promoter
Ag, see silver
Air annealing, air firing
Al, aluminum, aluminum deposition, aluminum etch, aluminum film, aluminum metallization, aluminum sputtering
AlN, Aluminum nitride metallized substrate
Al2O3, aluminum oxide, alumina
Alloying
Ammonium fluoride etching solution
Amorphous silicon, a:Si
Anisotropic etching
Annealing, nitrogen, air
Anodization solution
As, Arsenic implant, arsenic diffusion, arsenic doped silicon
Antimony, Antimony diffusion, Antimony implant, Sb implant, antimony doped silicon
Ar, argon sputter clean, sputter etch
Ashing
Au, Au-Ge, Au-In, Au-Si, Au-Sn
Avalanche Breakdown
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Backlap and polish, backlaping
Barrel etch reactor, LFE
Base contact, base diffusion, base junction, base implant, base mask, base oxide, base resistance
Beam leads
Be, Beryllium, BeO, Beryllium Oxide
Bevel and stain epitaxial layer thickness measurement
BHF, buffered hydrofluoric etching, BOE, buffered oxide etch
Bipolar transistor, bipolar process, bipolar foundry, bipolar wafer, bipolar device, bipolar integrated circuit
Bird beak and bird crest
BJT, bipolar junction isolated transistors
Bonding pad, Bond pad
B, Boron implant, Boron doped oxide, Boron doped silicon
Bipolar process
Bipolar transistor, bipolar transistor doping profile, bipolar wafer foundry
Breakdown voltage, BVcbo, BVceo, BVebo, BVsd, BVgd
Bump, gold bump process, underbump metallization
Buried layer, buried collector
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Capacitance, junction capacitance, parasitic capacitance
Carrier concentration
Capacitors, MOS, MNOS, MIS, MIM
CF4 plasma etch
Channel stop, ion implanted channel stopper, channel implant
Chemical etchants, chemical etch of metals, chemical etch of silicon, chemical etch of oxide
Chip, chip capacitor, chip inductor, chip resistor
Cleaning, diffusion cleaning, tube cleaning
Cl, Chlorine oxidation, plasma etch
Contract fabrication
Cr, Chromium sputter deposition, etch, masks
Certificate of conformance
Class 10 clean room, Class 10 laminar flow hood
CMOS, complimentary metal oxide semiconductor
Collector contact, collector diffusion, collector junction, collector implant, collector mask, collector oxide, collector resistance
Complimentary bipolar process, transistors
Complimentary bipolar process, Complimentary bipolar foundry, Complimentary bipolar wafer, Complimentary bipolar integrated circuit
Contacts to silicon, silicide, resistor film, contact etch, contact printing, contact resistance
Cu, copper film, copper deposition, copper electroplating, copper etch, copper sputtering, copper metallization
Copper displacement plating solution
CP-4, CP-6, CP-8 etchants, composition, etch rates
C-V measurement
CZ silicon, Czochralski grown silicon
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DC Magnetron sputtering
Dehydration, Dehydration oven, dehydration treatment
Depletion mode transistors, depletion layer width
Deposition, deposition services
Deposited films, deposited metals, deposited nitride, deposited oxides, deposited silicon
Deposition rate, sputtering, PECVD, LPCVD, electroplating
Design
Device design, device manufacturing, device processing, device reliability
DI water, deionised water
Dielectrics, dielectric films, dielectric constant of materials
Diamond like film deposition
Dicing saw, wafers, ceramic, quartz
Die bonding, die attach, die attach eutectic
Dielectric constant of various common ceramic materials
Dielectric depositions, reactive sputtered dielectric deposition, PECVD dielectric deposition, spin on glass
Die
Dicing, see sawing
Diffused capacitors, diffused diodes, diffused junctions, diffused resistors
Diffusion, diffusion cleaning, diffusion layer, ion implanted source, lateral diffusion, open tube, diffusion doping profile
Diffusion furnace operating conditions, ramping rates, diffusion and oxidation
Diffusion tube, diffusion tube cleaning, diffusion cleaning, diffusion preclean
Diodes, diffused diodes, junction diodes, photo diodes, schottky diodes, zenner diodes doping profile
Discrete semiconductor components
DMOS
Doped Oxide, Doped polysilicon, silicon
Doping, vapor phase doping, in situ doping, ion implant doping
Doping profile of bipolar transistors, doping profile of diffused junctions
Dry oxidation of silicon, dry oxide
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Electromigration
Electron mobility
Electroplating, electroplating solution
Ellipsometer
Emitter ballasted transistor
Emitter diffusion, emitter push effect, emitter implant, emitter mask, emitter oxide, emitter resistance, emitter washout process
Enhancement mode transistors
Epi deposition, Epitaxy, epitaxial devices, epitaxial deposition, epitaxial layers, epitaxial layer thickness measurement
epitaxial layer pattern shift and pattern distortion
Erfc diffusion, erfc profile
Etch, Etching, anisotropic, isotropic etching, etch profile
Etchants for oxide, nitride, metals
Etch rates for plasma etch, etch rates for wet etch, etch rate for sputter etch process
Eutectic, eutectic die attaching
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Fe2O3, see iron oxide
Field effect transistor
Field implant, field oxide
Film, films, film deposition, film deposition conditions, sputtering, LPCVD, PECVD
Film properties of oxides, film properties of nitride
Fixed oxide charge
Float zone silicon
Fluorine gas plasma etch of Si, SiO2, Si3N4, metals
Four point probe measurement, 4pp instrument, 4pp measurements
Four-point probe method
Fundamental constants
Furnace operating conditions, ramping rates and insertion rates
FZ, float zone silicon
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Gain bandwidth product
Ga, Gallium, Gallium arsenide, GaAs, GaAs processing
Gas, Gases, gas plasma etch, gas supply, gas distribution, gas phse deposition
Gaussian diffusion profile
Gate, Gates, see MOS gates, Schottky gates
Germanium, Ge
Gettering, gettering of heavy metals via Chlorine oxidation
Glass substrates, glass deposition
Gold deposition, gold doping, gold films, gold etch, gold electroplating, gold diffusion, gold sputtering, gold alloying
Gold bump process
Grain boundary, Polysilicon grain boundary
Guard ring diffusion, guard ring implant, guard ring layout design
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Hall effect, hall mobility, hall sensors
Halogen, halogen plasma etch, halogenic oxidation
Heavy doping
Hexamethyldisilizane, see HMDS
Heteroepitaxy
High resistivity silicon, FZ, float zone silicon
High resistivity water
High temperature annealing
Hillocks
Hole mobility
Horizontal reactor
Hot wall reactor
Hydrogen, Hydrogen anneal, Hydrogen diffusion, hydrogen flow
HCl, hydrogen chloride etch, hydrogen chloride oxidation
HF, hydrogen fluoride etching solution
NH4F ammonium fluoride etching solution
Hydrophobic surface
HMDS, HMDS spin coating, HMDS adhesion promoter
Hyperabrupt junction diodes, Hyperabrupt profile, Hyperabrupt Schottky diodes
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Image reversal photoresist
Implant, Implanted resistors
Impurity concentration, impurity diffusion, impurity gradient, impurity profile, impurity redistribution
Index of refraction
In-situ etching, in-situ doping, in-situ cleaning
Integrated circuit process sequence
Interconnections, single metal interconnections, double metal interconnections
Interstitial
Intrinsic carrier concentration, intrinsic gettering
Iodine, Iodine etch, KI solution
Ion dose, Ion implant, ion implantation, ion implant activation, ion implant doping profile, implant dose, ion implantation
Ion implanted JFET
Ion implanted buried layer, Ion implanted collector, ion implanted base, ion implanted emitter
Ion implanted source, Ion implanted Drain
Ion implanted resistor
IPA, IPA dry, Isopropyl alcohol
Iron
Iron oxide film, iron oxide deposition, iron oxide masks
ISO 9000 compliance, ISO 9000 compliant
Isolation, isolation diffusion, isolation mask
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JFET, J-FET diffused
Junction curvature, junction delineation, junction diffusion, junction depth, junction formation, junction isolation, junction lag, junction staining
Junction diode, junction field effect transistor
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K, see
potassium
hydroxide KOH, KOH etch, KOH anisotropic etch, KOH silicon etch
KTFR, see negative resist, negative photoresist
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Laminar flow, laminar flow hood
Laser
Laser trim
Laser trimming
Laser resistor trimming
Laser thin film resistors trimming
Laser thin film resistors trimming services
Laser ablation
Laser annealing
Laser drilling
Laser cutting
Laser machining
Lateral diffusion, lateral spread
Lateral p-n-p transistor, lateral PNP transistors
Lifetime
Lift-off process
Linear oxidation rate constant
LiNbO3 process
Layout design
Loading effect
Local oxidation, LOCOS, Locally oxidized transistor
Low reverse gain transistors
LPCVD epitaxial deposition, LPCVD epitaxial process
LPCVD nitride deposition, LPCVD nitride process
LPCVD oxide deposition, LPCVD oxide process
LPCVD Polysilicon deposition, LPCVD Polysilicon process
Low pressure chemical vapor deposition
Low pressure reactor
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Magnetron
Mask, mask design, mask manufacturing, manufacturing borosilicate mask, chrome mask, low reflectivity chrome mask, e-beam mask, emulsion mask, iron oxide mask, see through mask, silicon mask, sodalime glass mask, master mask, reticle, working mask
Mask alignment, mask alignment keys
Masking
Mass flow controller
Measurement, 4pp measurement, sheet resistance measurement, thickness measurement, refractive index measurement
Measurement of resistivity
MEMS, MEMS contract fabrication, MEMS process development, MEMS wafer foundry
Mesa etch, mesa isolation
MESFET
Metallization and Lift-off, multi-layer metallization, single-layer metallization, multi-level metallization, single-level metallization
Metal, Metals deposition, metal films, metal etch, metal mask, metal patterning
Metal oxides, metal nitrides, metal silicides
Metalorganic
Metals refractory
Metal Oxide Semiconductor, MOS, MOS transistor, MOSFET
Metal semiconductor junction, Schottky barrier diode
Military standard, MIL 883
MNOS transistors
Mobility
Molecular beam epitaxy
Mo, Molybdenum, Molybdenum deposition, molybdenum sputtering, molybdenum film, molybdenum etch, molybdenum gate, molybdenum metallization, molybdenum interconnection layer
MOS, MOSFET
MOS capacitor, MOS devices, MOS transistor
Multi-emitter transistor, multiple diodes, multiple implants
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Narrow slot, diffusion
N-channel transistor
Nitrogen annealing, nitrogen flow
NMOS
Non volatile memory
NPN transistor
n+ - p - n+ transistor
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Ohmic contact, ohmic contacts to silicon, ohmic contacts to silicides
Optical mask, optical printing, optical printer
Optoelectronic application, optoelectronic devices
Organometalic
Orientation of silicon, orientation effects
Overetch
Oxidation, oxidation rate, Oxidation-induced stacking faults, oxidation tube, oxidation furnace
Oxide deposition, oxide etch, oxide isolation, oxide isolated
Oxide color chart, oxide masking properties, oxide growth rate, oxide isolation
Oxygen, oxygen plasma, oxygen flow
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Pad oxide and silicon nitride deposition, bird beak and bird crest
Palladium, Palladium deposition, Palladium sputtering, Palladium film, Palladium etch, Palladium metallization, Palladium silicide
Parabolic oxidation rate constant
Parasitic capacitance, parasitic junction
Partial pressure
Paper less
Passive components
Pattern, pattern delineation, pattern generation, pattern shift, pattern
distortion
P-channel JFET, p-channel transistor
Pd, Palladium, Palladium deposition, Palladium sputtering, Palladium film, Palladium etch, Palladium metallization, Palladium silicide
PECVD see plasma enhanced chemical vapor deposition, PECVD Nitride deposition, PECVD Oxide deposition, PECVD amorphous silicon deposition
Penetration depth, ion implant depth
Peritectic reaction
Permalloy
Permeability
Phosphoric acid etch of silicon nitride, Phosphoric acid and aluminum etch, H3PO4
Phosphorus, Phosphorus diffusion, Phosphorus ion implant, Phosphorus doped silicon, Phosphorus doped glass
Phosphosilicate glass
Photolithography
Photoresist, photoresist coating, photoresist masking, negative photoresist, positive photoresist, photoresist removal, photoresist strip, photoresist ashing, photoresist develop, photoresist expose, photoresist soft bake, photoresist hard bake, photoresist adhesion, photoresist UV flood exposure, photoresist image reversal
Pinch off voltage
Pinch resistor
Planar process, planar technology, planar junction, planar reactor, planar plasma etch reactor, planarization
Plasma, plasma anodization, plasma ashing, plasma assisted etching, plasma etch, plasma etching, plasma clean, plasma reactor
Plasma Enhanced chemical vapor deposition, see PECVD, Nitride deposition, PECVD Oxide deposition, PECVD amorphous silicon deposition
Plating, plated gold, plated copper, plated silver, plating solution
Platinum, see Pt, Platinum deposition, Platinum sputtering, Platinum film, Platinum etch, Platinum metallization, Platinum silicide
pn junction
PNP transistor
Polycrystalline silicon
Polishing, Polishing etch, polished wafers, polished ceramic, polished silicon, polished quartz wafers, polished glass wafers
Polyimide
Polysilicon emitter, Polysilicon deposition, Polysilicon sputter deposition, Polysilicon oxidation, Polysilicon doping, Polysilicon etching, Polysilicon anisotropic plasma etching, LPCVD undoped polysilicon deposition, Polysilicon gate, Polysilicon growth
Positive resist, positive photoresist
Printing, contact printing, optical printing, projection printing, proximity printing, printing defects
Process control, process development, process flow, process run sheet, process run traveller, process work sheet
Projected range and ion implantation
Projection printing
Proximity printing
PSG, see Phosphorus doped glass
Pt, see Platinum, Platinum deposition, Platinum sputtering, Platinum film, Platinum etch, Platinum metallization, Platinum silicide
Purple plague and gold aluminum intermetallics
Pyrogenic oxidation process, Pyrogenic oxide
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Quality, Quality audit, Quality manual, Quality system
Quartz, Quartz boat, Quartz deposition, quartz mask, Quartz polishing, Quartz tube, Quartz substrate, Quartz wafer
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R&D, R&D contract, R&D facility, R&D support, R&D wafer fab, R&D wafer foundry
Radial resistivity
Ramping rate
Reactive ion etching, see RIE
Reactive sputtering
Reactor, barrel reactor, low pressure reactor, planar reactor, tunnel reactor
Refractive index measurement
Refractory metals
Reflow methode, reflow of doped oxide, reflow of photoresist
Registration between mask layers
Reliability, reliable metallization, reliable process
Research and development contract, Research and development facility, Research and development support, Research and development wafer fab, Research and development wafer foundry
Residual film stress
Resist, see photoresist
Resistance
Resistor, resistors, diffused resistors, implanted resistors, thin film resistors, pinch resistors, resistor trim
Resistivity, resistivity measurement, resistivity versus temperature, see TCR
Reticle, reticle mask, see also mask stepper
RF magnetron, RF plasma etch
RIE, see reactive ion etching also
Rsq, sheet resistance measurement
Run sheet
Run traveler Runsheet
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Sapphire, Sapphire substrate, Sapphire polishing, Sapphire
dicing
Saw, sawing, sawing process, sawing service
Scribe line, scribing
Sealed junction technology
Selective epitaxy, selective etching
Se, Selenium
Self aligned gate process, self alignment, self aligning method
Self isolated transistor, self isolation
Semiconductor, semiconductor components, semiconductor equipment, semiconductor processing, semiconductor services
Semi-insulating
Shallow diffusion, shallow junction, shallow implant, shallow impurities
Silane, SiH4
SiC, silicon carbide, silicon carbide deposition
SiCr, sichrome films, sichrome deposition
SiN, Si3N4
Silica glass, silica etch, see oxide etch
Silicon components
Silicon integrated circuits
SiO2, SiO, SiOxNy, SIPOS
Silicide etch, silicide growth, silicide oxidation, silicide properties
Silicides, Ti, Ta, Pt, Mo
Silicon dioxide, Silicon dioxide etch, Silicon dioxide plasma etch, Silicon dioxide deposition
Silicon nitride, silicon nitride deposition, silicon nitride etch rate, silicon nitride film properties, silicon nitride refractive index
Silicon anisotropic etches, see KOH etch and plasma anisotropic etch of silicon and polysilicon
Silicon annealing, silicon anodization, silicon cleaning, silicon cleaving, silicon
crystallographic etches, silicon etch rates
Silicon polishing etches
Silicon denuded zone formation
Silicon dioxide, SiO2, Silicon dioxide etch, Silicon dioxide film, Silicon dioxide growth, Silicon dioxide deposition
Silicon dioxide reactive sputter deposition, Silicon dioxide PECVD deposition, Silicon dioxide LPCVD deposition
Silicon dioxide refractive index, Silicon dioxide color chart, Silicon dioxide dielectric properties, Silicon dioxide plasma etch
Silicon dioxide anisotropic plasma etch, Silicon dioxide BOE etch, Silicon dioxide BHF etch
Silicon nitride, SiN, SixNy, Si3N4, Silicon nitride, SiO2, Silicon nitride etch, Silicon nitride film, Silicon nitride growth, Silicon nitride deposition, Silicon nitride reactive sputter deposition, Silicon nitride PECVD deposition, Silicon dnitride LPCVD deposition
Silicon nitride refractive index, Silicon nitride color chart, Silicon nitride dielectric properties, Silicon nitride plasma etch
Silicon nitride anisotropic plasma etch, Silicon nitride H3PO4 etch, Silicon nitride phosphoric acid etch, Silicon nitride HF etch
Silicon on sapphire
Silicon oxynitride
Silver deposition, Silver bump, Silver films, Silver etch, Silver electroplating, Silver sputtering
Schottky, Schottky barrier diodes, Schottky barrier junction, Schottky contacts, Schottky defects, Schottky clamp diodes, Schottky cleaning, Schottky films, Hyperabrupt Schottky diodes
Schottky clamped process
Sheet resistance measurement, base sheet resistance, emitter sheet resistance, epi layer sheet resistance
Sn see tin deposition
SnO2 see tin oxide deposition
SnPb 60-40 see tin-lead deposition
Sodium gettering, sodium passivation
Solid solubility
SOS transistors, SOS process
Source - drain contacts, Source - drain layout, Source - drain diffusion, Sorce - drain implant
SPC, see statistic process control
Sputter cleaning
sputter deposition
Sputtering, sputtering yields
Sputtered films, sputtered aluminum, sputtered aluminum nitride, sputtered copper, sputtered chrome,
sputtered gold, sputtered iron oxide, sputtered molybdenum, sputtered nickel, sputtered nickel - chrome, sputtered nickel - vanadium, sputtered silicon, sputtered silicon nitride, sputtered silver, sputtered tin, sputtered tin oxide, sputtered tin lead, sputtered titanium, sputtered tantalum, sputtered tantalum silicide, sputtered tantalum nitride, sputtered tungsten, sputtered zirconium
Stacking fault method, Stacking faults, Stacking fault etch
Statistic process control
Steam oxidation
Step coverage
Step junction
Step and repeat
Stepper
Stirring
Stress
Substrate holder,
Sulfur hexafluoride plasma etch
Superbeta transistors
Surface barriers metal semiconductor, surface charge, surface resistivity
Surface concentration, surface inversion, surface mobility, surface reflectivity
Susceptor
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Ta, Tantalum, Tantalum deposition, Tantalum sputtering, Tantalum film, Tantalum etch, Tantalum metallization, Tantalum silicide
TaN, Tantalum Nitride deposition, Tantalum Nitride sputtering, Tantalum Nitride film, Tantalum Nitride etch
Tantalum Nitride Thin film resistors
TaSi2, Tantalum Silicide deposition, Tantalum Silicide sputtering, Tantalum Silicide film, Tantalum Silicide etch
Tantalum Silicide thin film resistors
Ta TiW Au
TaN TiW Au
Te, Tellurium deposition, .........
Thermocompression bonding
Thin film resistors deposition, thin film resistors plasma etch, thin film resistors lift-off process, thin film resistors patterning
Thin film resistors stabilization process, thin film resistors annealing process, thin film resistors process
Ti, Titanium, titanium deposition, titanium etch, titanium silicide, titanium silicidation
TiN, titanium nitride deposition, titanium nitride properties, titanium nitride wet etch, titanium nitride plasma etch
TiW, titanium-tungsten deposition, titanium-tungsten properties, titanium-tungsten wet etch, titanium-tungsten plasma etch
Ti Ni Ag
Ti NiV Ag
Ti Pd Au
Ti Pt Au
TiW Au
TiW TiWNx TiW Au
TCR, see thermal coefficient of resistance
Thermal coefficient of resistance
Thermal oxide, thermal oxidation, thermal anneal, thermal processing, thermal treatment
Thin film deposition, thin film sputter deposition, thin film sputtering deposition, thin film devices, thin film resistors
Thickness measurement
Threshold voltage
Transistor, bipolar transistor, emitter ballasted transistor, field effect transistor, low reverse gain transistor, MOS transistor, multi-emitter transistor, self-isolated transistor, superbeta transistor, NPN transistor, PNP transistor, lateral PNP transistor, vertical NPN transistor, vertical PNP transistor, TMOS transistor, Triply diffused transistor
Triply diffused process
Tube, tube cleaning, diffusion tube cleaning
Tungsten, W, tungsten sputtering deposition, tungsten etch, tungsten silicide, tungsten silicidation
Tungsten nitride, WNx, tungsten nitride deposition, tungsten nitride reactive sputtering deposition, tungsten nitride properties, tungsten nitride wet etch, tungsten nitride plasma etch
Tunnel reactor
Twin tabs, twin diffusion tabs
Two-step diffusion
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Ultrasonic bonding
Ultrasonic cleaning
Undercut
Universal constants
UV exposure, UV flood exposure
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V/I, 4pp measurement of V/I
Van der Pauw, Van der Pauw measurement, Van der Pauw structure design
Vapor dry in IPA, IPA dry, Isopropyl alcohol vapor dry
Vendor, vendor quality system audit
VMOS
Vertical NPN transistors
Vertical PNP transistors
Vertical reactor
Voltage breakdown, BVcbo, BVceo, BVebo, BVsd, BVgd
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W, tungsten, W PtSi Si
Wafer bumping process, services
Wafer cleaning procedures
Wafer dicing
Wafer fab, wafer fabrication, wafer process, wafer processing
Wafer foundry
Wafer thinning, wafer thinning process, wafer thinning procedure
Washout, washout emitter, emitter washout process
Water, DI water, deionised water, high resistivity water
Wet etch, wet etching, wet anisotropic etch
Wet oxide, wet oxidation process
Work in progress, WIP
Work sheet
Working mask
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X-ray printing, Xe, Xenon
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Yield, Yield enhancement, Yield specification
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Zinc, Zn
ZnO, zinc oxide
Zr, Zirconium
Zenner diodes
Zero bias diode, ZBD
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HYPERION |
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HYPERION
GROUP
AVIONICS
AUTOMOTIVE
COMMUNICATIONS
DEFENSE
MEDICAL
SPACE
TECHNOLOGY
SOLUTIONS |
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HYPERION GROUP GOLD CHIP TECHNOLOGY FOR
THE FUTURE |
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HYPERION GROUP Companies, design
and manufactures standard and custom semiconductor components for
avionics, automotive, communications, computing, defense, medical,
military, optoelectronics, telecommunications, space and
wireless applications.
HYPERION has undertaken the task to redesign and manufacture the
future semiconductor components compatible with chip and wire, flip
chip, chip scale CSP and surface mount technologies. In today's
extreme miniaturization market, there is no more room for the large
packages to protect the die. It means that the bare die has to
survive on its own without the protection of a package. Known Good
Die is useless if the die cannot withstand harsh environmental
conditions and degrades. The solution developed by HYPERION for
known good die for bare die applications is gold interconnection and
well-engineered materials that further enhance the die reliability.
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